How can liquid-cooled oxygen-free copper drive a revolution in efficient heat dissipation in the AI era with its high purity and superior thermal conductivity?
Publish Time: 2025-12-26
With the rapid expansion of artificial intelligence, high-performance computing, and data centers, chip power consumption continues to rise, and traditional air cooling can no longer meet the demands for rapid heat dissipation. Liquid cooling technology, due to its high efficiency, quiet operation, and energy savings, is becoming standard in next-generation computing infrastructure. In this crucial heat dissipation path, liquid-cooled oxygen-free copper—a highly purified copper material with extremely low impurity content—has become the preferred material for core components such as server cold plates, liquid cooling pipes, and power busbars, silently building the physical foundation for the "cool operation" of the digital world, thanks to its near-perfect thermal conductivity, excellent corrosion resistance, and reliable processing adaptability.The core advantage of liquid-cooled oxygen-free copper stems from its extremely pure metallic structure. Through vacuum melting and refining processes, oxygen and other impurity elements are reduced to extremely low levels, eliminating not only the brittleness risk caused by cuprous oxide inclusions but also ensuring a highly intact crystal structure. This high purity endows the material with near-theoretical thermal conductivity, allowing it to rapidly diffuse heat laterally and transfer it to the cooling medium upon contact with a heat source. This significantly reduces chip junction temperature and ensures stable processor performance under full load. In millisecond-level thermal response, oxygen-free copper, with its metallic body, acts as a "thermal highway."Excellent corrosion resistance is key to its long-term reliable operation. Although the circulating medium inside the liquid cooling system is treated, it may still contain trace amounts of ions or dissolved oxygen, posing a potential risk of corrosion to metal pipes. Oxygen-free copper, free of easily oxidizable impurities, has highly stable chemical properties and effectively resists the electrochemical corrosion of water-based coolants. To further enhance its protective capabilities, its surface can be passivated to form a dense protective film, significantly slowing down the oxidation process and ensuring a service life of several years or even more than ten years, preventing system failure due to pipe wall perforation or deposit blockage.In terms of processing and integration flexibility, liquid cooling oxygen-free copper exhibits outstanding adaptability. It can be precisely drawn into copper tubes of various diameters and wall thicknesses for constructing complex flow channels; it can also be rolled into high-flatness copper plates, and then CNC-machined or stamped into integrated microchannel cold plates; it can also be made into high-conductivity copper busbars, simultaneously undertaking the dual functions of high-current transmission and auxiliary heat dissipation. Its excellent ductility and weldability support various connection methods such as brazing, TIG welding, or diffusion bonding, ensuring a leak-free, sealed liquid cooling circuit and meeting the stringent requirements of data centers for zero-failure operation.Furthermore, the surface quality and cleanliness of oxygen-free copper are perfectly suited to high-end electronic manufacturing environments. The finished product has a smooth, burr-free surface and extremely low internal roughness, reducing fluid resistance and the risk of particle shedding; the production process takes place in a controlled cleanroom, avoiding oil and dust contamination and ensuring compatibility with sensitive electronic components. This meticulous attention to detail makes it a trusted choice for liquid cooling modules in AI accelerator cards, GPU servers, and supercomputing nodes.As trillions of operations surge across the chip and the temperature inside the server rack quietly rises, liquid cooling oxygen-free copper silently and efficiently conducts heat, transforming the intense heat into a controllable cooling flow. it remains unseen, yet defines the upper limit of heat dissipation through its metallic purity. Because in the underlying logic of high-performance computing, true stability begins with meticulously purified and precisely shaped heat conduction pathways—and this is precisely the irreplaceable value of liquid-cooling oxygen-free copper.
